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PRODUCT

Semiconductor

Underfill Dispensing (Jet-valve)
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Items Description
Line Width >50μm
Viscosity <2,000cPs
Supply air pressure 0.5 Mpa or less
Technology EHD and Jetting Valve
Max HZ 400HZ
Response time 1ms
Applicable Fluids Enzyme, Insulant fluid, EV resin, etc.

Description

  • Fast Underfill
  • The Hybrid system: Solenoid & Air + EHD (Electrohydrodynamic)
  • Realtime Control & EHD effect
  • Extremely uniform droplet generation

Technology

iEHD Printing Technology

iEHD Printing Technology

List