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PRODUCT

E-Materials

LP Ink Non-Conductive Ink
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Items Description
Viscosity(cPs) 50~10,000
Adhesive (Cover glass) 5B
Electric Resistivity (Ω·cm) Confidential
Low Curing Temp ~130℃/30min

Description

  • Thermal curing ink of epoxy base
  • Soft type
  • High transparence
  • Underfill Insulation coating
  • ON market

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