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Semiconductor
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E-Materials
LP Ink
Non-Conductive Ink
Items
Description
Viscosity(cPs)
50~10,000
Adhesive (Cover glass)
5B
Electric Resistivity (Ω·cm)
Confidential
Low Curing Temp
~130℃/30min
Description
Thermal curing ink of epoxy base
Soft type
High transparence
Underfill Insulation coating
ON market
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