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Semiconductor
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E-Materials
EP Ink
Non-Conductive Ink
Items
Description
Viscosity(cPs)
100~500
Adhesive (Cover glass)
5B
Electric Resistivity (Ω·cm)
Confidential
Curing Temp
150~200℃/30min
Description
Thermal curing ink of epoxy base
Hard type insulation coating (spray, printing)
Underfill Ink
Low CTE
Technology
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