ENJET PRINTER

We are leading the ultra-fine patterning technology based on the automation function implementation of high-precision patterning system,
multi nozzles, automatic focus, stable ink supply, and laser integration technology.

  • eMicroJet Printer
  • DESCRIPTION

    · Conventional dispensers have drawbacks such as pattern size with high viscous material

    · Patented eMicrojet Printer can overcome these drawbacks based on iEHD jetting technology and novel nozzle and valve design

    · eMicrojet printer allows high precision dispensing and high resolution patterning, which is able to be applied in many areas

  • PRINTING MODE

    · Line Mode

    · Dotting Mode

  • FIGURE

    · Line Width : 100 ~ 1,000㎛

    · Viscosity : 1 ~ 50,000 cPs

  • OLED TFT Ink Repair
  • DESCRIPTION

    · Product: OLED TFT Ink Repair System (6Gen.)

    · Based on the innovative iEHD Jet Printing technology, it can repair the open defects in the thin-film-transistor

    · With novel laser technology, it can repair short defects

  • MXII Printer(Stand-alone / Customized)
  • DESCRIPTION

    · The interchangeable module design allows MX2 to use all the nozzle sizes/types. This makes the MX2 fit with all precision dispensing applications : electrospinning, underfill, precise dot and line dispensing

    · Employing state-of-art flatness sensor, MX2 can print on non-flat surface with ease

    · Nozzle auto-alignment allows changing module/nozzle with ease while ensure precise printing

  • Module based Platform: MXII Printer(Desk-top / R&D)
  • DESCRIPTION

    · The Module based platform supports customers with powerful tools, which are easily replaced. Customers, who want to manufacture small scale with various tools such as printing, coating, cutting, marking, or sintering, can use this solution. And researchers in a lab can use multiple functions in one system

  • PRINTING MODULE

    · Standard EHD Module (STD Module)

    · High Resolution EHD Module (HR Module)

    · Pressure EHD Module (PRS Module)

ENJET COATER

High resolution and ultra-uniform coating technology
based on iElectrohydrodynamic (iEHD) fluid control.

Secondary Cell Battery Catalyst Coatings & Recycling

iEHD spray technology can coat a variety of metal alloys using electric fields, including the manufacture of secondary cell catalyst coatings based on the rare metals platinum, nickel, iridium, and ruthenium.
It is possible to implement a very dense coating film with less than 1% uniformity on a maximum of 1800x1000 substrate, and material loss due to scattering during spraying can be minimized by collecting with an electric field.

  • eNC-350
  • INTRODUCTION

    · Optimized for PCB Flux Coating - EHD nozzles (3ea)

    · Spraying nano materials

    · Saving materials by improving delivery rate

    · Improvement of material adhesion

    · User Friendly programmed GUI, convenient operation, production history management

    · Available for various materials

    · Easy nozzle replacement

    · Automatic inspection of coating weight

    · Customized design and equipment production according to material characteristics

    · Qualified by global display manufacturing company

  • FIGURE

    · 3 Nozzles, Reliable Chemical Supply System(CSS)

    · Coating materials weight measurement system

    · Sorting system

    · Plasma unit (optional)

  • SPECIFICATION
  • APPLICATION

    · Anti-Glare Coating(Heating Method)

  • eNC-500
  • INTRODUCTION

    · Optimized for Anti-Glare Coating with heated stage

    · EHD nozzles (3ea)

    · Dual stages system

    · Spraying nano materials

    · Saving materials by improving delivery rate

    · Improvement of material adhesion

    · User Friendly programmed GUI, convenient operation, production history management

    · Available for various materials

    · Uniformly heating stage unit

    · Easy nozzle replacement

    · Customized design and equipment production according to material characteristics

    · Qualified by global display manufacturing company

  • SPECIFICATION
  • APPLICATION

    · Anti-Glare Coating(Heating Method)

  • eNC-800s
  • INTRODUCTION

    · Optimized for PCB Flux Coating - EHD nozzles (3ea)

    · Spraying nano materials

    · Saving materials by improving delivery rate

    · Improvement of material adhesion

    · User Friendly programmed GUI, convenient operation, production history management

    · Available for various materials

    · Easy nozzle replacement

    · Automatic inspection of coating weight

    · Customized design and equipment production according to material characteristics

    · Qualified by global display manufacturing company

  • SPECIFICATION
  • APPLICATION

    · AF Coating, AS Coating, AR Coating

  • eNC-G100
  • INTRODUCTION

    · Specially designed and optimized for Anti-glare coating (non-heated)

    · EHD nozzles (3ea)

    · 2D/3D glasses available

    · Spraying nano materials

    · Saving materials by improving delivery rate

    · Improvement of material adhesion

    · User Friendly programmed GUI, convenient operation, production history management

    · Available for various materials

    · Easy nozzle replacement

    · Customized design and equipment production according to material characteristics

    · Qualified by global display manufacturing company

  • SPECIFICATION
  • APPLICATION

    · AF Coating, AS Coating, AG Coating, AR Coating

  • eNC-V80T
  • INTRODUCTION

    · Specially designed and optimized for functional coating with minimized contamination and particles

    · EHD nozzles (3ea)

    · Spraying nano materials

    · Reliable chemical supply system (CSS)

    · Saving materials by improving delivery rate

    · Improvement of material adhesion

    · User Friendly programmed GUI, convenient operation, production history management

    · Available for various materials

    · Easy nozzle replacement

    · Optimized ventilation system

    · Customized design and equipment production according to material characteristics

    · Qualified by global display manufacturing company

  • SPECIFICATION
  • APPLICATION

    · Hard Coating, Barrier Coating

  • eNC-200
  • INTRODUCTION

    · R&D purpose equipment

    · EHD nozzle and uniform ink supply pump

    · Functional nano materials coating

    · Material adhesion improvement

    · Suitable for material testing

    · User Friendly programmed GUI, convenient operation, production history management

    · Available for various materials

    · Easy nozzle replacement

  • SPECIFICATION
  • APPLICATION

    · AF Coating, AS Coating, AG Coating, AR Coating, EMI Shield Coating, Nano Particles Coating, Cover Coating

  • eNC-CSSModule
  • INTRODUCTION

    · Very stable and reliable chemical supply system

    · Improve the efficiency of the spray

    · Material supply, Pneumatics, Bubble remover, Uniform pump

    · Professional solution for manufacturing

    · convenient operation

    · customizable

  • SPECIFICATION
  • APPLICATION

    · Conversion of the existing spray equipment. (Saving materials, improving efficiency)

PLASMA

Enjet has developed a patented RF plasma head, based on precise fluidic control technology, which can allow stable Plasma Ignition.

  • eNPL-Ar90s
  • INTRODUCTION

    · Atmospheric pressure plasma generator consists of novel designed head, matcher, RF power generator

    · It is applied to enhance the performance of the washing / adhesion / coating / plating / evaporation etc. It is also applied to cleaning and surface treatment in many industries such as display, film, touch panel, battery, PCB, vehicle, semiconductor, etc.

  • FIGURE

    · Plasma Module

    · Electrode Headset : 810mm x 90mm x 60mm

    · Scan Width: 800mm

    · Metal Body : Anodized Al

    · Gas : Ar/O2/He/C4F8

    · Power Supply : 1,000W

    · Hydrophillic, Hydrophobic

  • SPECIFICATION
  • APPLICATION

    · Display, Semiconductor, TSP, Film, Cleaning

INK

ENJET ink is a particle-free ink that can be cured at low temperatures, making it suitable for printed electronics.

  • Ag(Silver) ink for eNanojet Printer
  • DESCRIPTION

    · Ink Model : RS Ag Conductive Precursor Ink

    · Viscosity : 50 cPs

    · Resistivity : 5 ⅹ10^(−5) Ω·cm (@180 °C / 30 min)

  • · It is developed for micro-LED chip bonding. It has high performance of bonding and electrical characteristics

  • KOREA(16643) No.45, Saneop-ro 92beon-gil, Gwonseon-gu, Suwon-si, Gyeonggi-do, Korea
  • SALES TEAM+82-70-4892-8111
  • CUSTOMER CENTER+82-70-4892-8100
  • E-MAILsales@enjet.co.kr
  • CHINAHuizhou Zhongkai High-tech Zone Chenjiang Street Zhongkai Sixth Road No. 137 Plant G, Plant H, 1st Floor
  • MOBILE+86 159-1400-8005

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